The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Mar. 06, 2014
Globalfoundries Inc., Grand Cayman, KY;
Ronald G. Filippi, Wappingers Falls, NY (US);
Erdem Kaltalioglu, Newburgh, NY (US);
Andrew T. Kim, Poughkeepsie, NY (US);
Ping-Chuan Wang, Hopewell Junction, NY (US);
Lijuan Zhang, Beacon, NY (US);
GlobalFoundries, Inc., Grand Cayman, KY;
Abstract
The present invention relates generally to flip chip technology and more particularly, to a method and structure for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure. In an embodiment, a method is disclosed that may include forming a bonding pad having one or more anchor regions that extend into a semiconductor structure and may inhibit the bonding pad from physically separating from the TSV during temperature fluctuations.