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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9475272 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Oct. 09, 2014

De-bonding and cleaning process and system

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ying-Ching Shih, Taipei, TW;

Jing-Cheng Lin, Chu Tung Zhen, TW;

Szu Wei Lu, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas Harm

Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); B32B 38/16 (2006.01); H01L 21/02 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 38/162 (2013.01); B32B 38/10 (2013.01); B32B 38/1858 (2013.01); B32B 2310/0825 (2013.01); B32B 2310/0831 (2013.01); B32B 2310/0843 (2013.01); H01L 21/02076 (2013.01); H01L 21/02096 (2013.01); Y10S 901/40 (2013.01); Y10S 901/43 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1928 (2015.01);
Abstract

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

Find Patent Forward Citations

Shih, Ying-Ching. (2016). De-bonding and cleaning process and system (U.S. Patent No. 9475272). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9475272

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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