The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Jun. 12, 2015
Applicant:

Cadence Design Systems, Inc., San Jose, CA (US);

Inventors:

Brian Edward Foutz, Charlottesville, VA (US);

Steev Wilcox, San Jose, CA (US);

Vivek Chickermane, Slaterville Springs, NY (US);

Krishna Vijaya Chakravadhanula, Vestal, NY (US);

Paul Alexander Cunningham, Mountain View, CA (US);

Assignee:

Cadence Design Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/22 (2006.01); G06F 17/50 (2006.01); G01R 31/3177 (2006.01);
U.S. Cl.
CPC ...
G01R 31/3177 (2013.01);
Abstract

Methods and computer-readable media for effecting physically efficient scans of integrated circuit designs may include selecting a two-dimensional grid size for exposure to the method, the two-dimensional grid having a size that includes a first side length, a second side length, and a number of flops. The method is performed to select a two-dimensional grid size that maximizes compression efficiency and limit wiring congestion on the IC. In one aspect, the method may be performed on each region of the grid that maintains one of a respective first side length and a respective second side length greater than one, including selecting a larger side, determining if the larger side is odd or even, and dividing the grid along the larger side into two regions each having a proportion of the flops. The scans of the resulting regions are efficient, and consequently facilitate integrated circuit design and subsequent manufacture.


Find Patent Forward Citations

Loading…