The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Oct. 06, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Chu Liu, Shin-Chu, TW;

Yi-Shien Mor, Hsinchu, TW;

Kuei-Shun Chen, Hsinchu, TW;

Yu Lun Liu, Beidou Township, TW;

Han-Hsun Chang, Hsinchu, TW;

Shiao-Chian Yeh, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/32139 (2013.01); H01L 21/76802 (2013.01); H01L 21/76885 (2013.01); H01L 27/0629 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of making a structure includes forming a first supporting member over a substrate, the first supporting member comprising a first material and having a first width defined along a reference plane. The method further includes forming a second supporting member over the substrate, the second supporting member having a second width defined along the reference plane, and the first supporting member and the second supporting member being separated by a gap region. The first width is at least 10 times the second width, and a gap width of the gap region being from 5 to 30 times the second width.


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