The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jul. 12, 2010
Applicants:
Saravuth Sirinorakul, Bangkok, TH;
Suebphong Yenrudee, Bangkok, TH;
Inventors:
Saravuth Sirinorakul, Bangkok, TH;
Suebphong Yenrudee, Bangkok, TH;
Assignee:
UTAC HEADQUARTERS PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4821 (2013.01); H01L 23/495 (2013.01); H01L 24/14 (2013.01); H01L 24/81 (2013.01); H01L 23/49582 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/11822 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81194 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/181 (2013.01);
Abstract
A support feature on a leadframe to support a semiconductor die during placement of the die on the leadframe and minimize the collapsing effect of the connector bumps of the die after reflowing. In some embodiments, the support features are formed from material that is different from the leadframe, such as by a ball drop process or a plating process. In some embodiments, the support features are formed from the leadframe material, such as by etching. In some embodiments, the support features are covered with a coating material.