The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
May. 07, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Xin-Hua Huang, Xihu Township, TW;
Ping-Yin Liu, Yonghe, TW;
Hung-Hua Lin, Taipei, TW;
Xin-Chung Kuang, Hsinchu, TW;
Yuan-Chih Hsieh, Hsin-Chu, TW;
Lan-Lin Chao, Sindian, TW;
Chia-Shiung Tsai, Hsin-Chu, TW;
Xiaomeng Chen, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 21/02 (2006.01); B23K 1/20 (2006.01); B23K 1/00 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01);
U.S. Cl.
CPC ...
B23K 1/206 (2013.01); B23K 1/0016 (2013.01); B23K 20/026 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); B23K 2201/42 (2013.01);
Abstract
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.