The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Aug. 24, 2015
Applicant:

Tokyo Seimitsu Co., Ltd., Hachioji-Shi, Tokyo, JP;

Inventors:

Yuichi Ozawa, Tokyo, JP;

Hiroshi Nishimura, Tokyo, JP;

Seiichi Ohta, Tokyo, JP;

Yasuhito Iguchi, Tokyo, JP;

Kunihiko Chiba, Tokyo, JP;

Ken Kato, Tokyo, JP;

Assignee:

Tokyo Seimitsu Co., Ltd., Hachioji-Shi, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/28 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2831 (2013.01); G01R 1/0408 (2013.01);
Abstract

The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.


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