The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Aug. 25, 2014
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Junqing Huang, Fremont, CA (US);

Huan Jin, Dublin, CA (US);

Grace Hsiu-Ling Chen, Los Gatos, CA (US);

Lisheng Gao, Saratoga, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/62 (2006.01); G01N 21/95 (2006.01); G06T 5/00 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G06T 5/002 (2013.01); G06T 2207/20061 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.


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