The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Oct. 10, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Yi Qi, Niskayuan, NY (US);

Catherine B. Labelle, Schenectady, NY (US);

Xiuyu Cai, Niskayuna, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01); H01L 29/78 (2006.01); H01L 27/12 (2006.01); H01L 29/10 (2006.01); H01L 29/06 (2006.01); H01L 29/775 (2006.01); H01L 29/423 (2006.01); H01L 21/762 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7849 (2013.01); H01L 21/76224 (2013.01); H01L 21/845 (2013.01); H01L 27/1211 (2013.01); H01L 29/0653 (2013.01); H01L 29/0673 (2013.01); H01L 29/1054 (2013.01); H01L 29/42392 (2013.01); H01L 29/6656 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66818 (2013.01); H01L 29/775 (2013.01);
Abstract

A dual-strained Si and SiGe FinFET device with dielectric isolation and a dual-strained nanowire device and methods of forming them are provided. Embodiments include a SiGe SRB formed on a silicon substrate, the SRB having a first region and a second region; a first and a second dielectric isolation layer formed on the first region and on the second region of the SiGe SRB, respectively; a tensile strained Si fin formed on the first dielectric isolation layer; a compressive strained SiGe fin formed on the second dielectric isolation layer; first source/drain regions formed at opposite sides of the tensile strained Si fin; second source/drain regions formed at opposite sides of the compressive strained SiGe fin; a first RMG formed between the first source/drain regions; and a second RMG formed between the second source/drain regions.


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