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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9431360 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

May. 27, 2014

Semiconductor structure and manufacturing method thereof

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Hsuan-Ting Kuo, Taichung, TW;

Yu-Peng Tsai, Taipei, TW;

Wei-Hung Lin, Hsinchu County, TW;

Chun-Lung Jao, Nantou County, TW;

Chao-Wen Shih, Hsinchu County, TW;

Ming-Da Cheng, Hsinchu Country, TW;

Chung-Shi Liu, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorney:

Chun-Ming Shih

Primary Examiner:

Vongsavanh Sengdara

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/544 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 24/94 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/94 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/206 (2013.01); H01L 2924/20656 (2013.01); H01L 2924/20657 (2013.01); H01L 2924/20658 (2013.01);
Abstract

A semiconductor structure includes a substrate including a front side, a conductive bump disposed over the front side, and an opaque molding disposed over the front side and around a periphery portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side.

Find Patent Forward Citations

Kuo, Hsuan-Ting. (2016). Semiconductor structure and manufacturing method thereof (U.S. Patent No. 9431360). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9431360

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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