The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jul. 18, 2014
Applicant:

Crossbar, Inc., Santa Clara, CA (US);

Inventors:

Harry Yue Gee, Milpitas, CA (US);

Steven Patrick Maxwell, Sunnyvale, CA (US);

Natividad Vasquez, Jr., San Francisco, CA (US);

Sundar Narayanan, Cupertino, CA (US);

Assignee:

Crossbar, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 45/00 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02664 (2013.01); H01L 21/0262 (2013.01); H01L 21/02532 (2013.01); H01L 21/02587 (2013.01); H01L 21/30625 (2013.01); H01L 27/2436 (2013.01); H01L 27/2463 (2013.01); H01L 45/1608 (2013.01);
Abstract

Techniques for processing silicon germanium (SiGe) thin films to reduce surface roughness thereof are provided herein. In an aspect, a method is disclosed that includes depositing a silicon germanium (SiGe) material upon a surface of a substrate at or below about 450 degrees Celsius, the substrate having a plurality of CMOS devices therein and forming, from the deposited SiGe material, a SiGe material film, wherein the SiGe material film has a jagged surface comprising projections and indentations extended along a direction substantially perpendicular to the surface of the substrate. The method further includes performing a chemical mechanical planarization (CMP) process to the jagged surface of the SiGe material, and reducing variations between the projections and the indentions along the direction substantially perpendicular to the surface of the substrate, and transforming the jagged surface of the SiGe material into a relatively smooth surface, compared to the jagged surface.


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