The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jan. 08, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akihito Ohno, Tokyo, JP;

Zempei Kawazu, Tokyo, JP;

Nobuyuki Tomita, Tokyo, JP;

Takanori Tanaka, Tokyo, JP;

Yoichiro Mitani, Tokyo, JP;

Kenichi Hamano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 29/68 (2006.01); C30B 25/20 (2006.01); C30B 29/36 (2006.01);
U.S. Cl.
CPC ...
C30B 29/68 (2013.01); C30B 25/20 (2013.01); C30B 29/36 (2013.01); Y10T 428/24331 (2015.01); Y10T 428/24612 (2015.01);
Abstract

A method for manufacturing a single-crystal 4H-SiC substrate includes: preparing a flat 4H-SiC bulk single-crystal substrate; and epitaxially growing a first single-crystal 4H-SiC layer having recesses on the 4H-SiC bulk single-crystal substrate, wherein the first single-crystal 4H-SiC layer has a thickness of X (μm), the recesses have a diameter Y (μm) no smaller than 0.2*X (μm) and no larger than 2*X (μm), and a depth of Z (nm) no smaller than (0.95*X (μm)+0.5 (nm)) and no larger than 10*X (μm).


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