The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Apr. 30, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;

Inventors:

Hsien-Chie Tsai, Taichung, TW;

Chang-Sheng Lee, Hsinchu, TW;

Fu-Yuan Chang, Taichung, TW;

Hung-Yin Lin, Taichung, TW;

Wen-Che Chang, Taichung, TW;

Chien-Pin Hsu, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/30 (2006.01); H01L 21/3065 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/3065 (2013.01); H01L 21/324 (2013.01);
Abstract

A method for controlling processing temperature in semiconductor fabrication is provided. The method includes detecting temperature in a first chamber configured to process a semiconductor wafer. The method further includes creating a flow of heat-exchange medium in a second chamber which is connected to the first chamber to cool the first chamber. The method also includes controlling the flow of heat-exchange medium according to the temperature detected in the first chamber by changing a covered area of a first ventilation unit which allows the entry of the heat-exchange medium to the second chamber.


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