The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Mar. 13, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chun-Lei Hsu, Keelung, TW;
Yu-Feng Chen, Hsin-Chu, TW;
Ming-Che Ho, Tainan, TW;
De-Yuan Lu, Taipei, TW;
Chung-Shi Liu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of packaging semiconductor dies may include: coupling a first die to a first substrate; forming a plurality of first portions of a plurality of metal pillars on a surface of the first substrate; forming a second portion of the plurality of metal pillars over each of the plurality of first portions of the plurality of metal pillars; forming a protection layer over sidewalls of each of the plurality of first portions and second portions of the plurality of metal pillars; coupling a second die to a second substrate; and coupling the plurality of metal pillars to the second substrate.