The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Jan. 31, 2013
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chao-Chun Wang, Hsinchu, TW;

Su-Jen Sung, Zhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76832 (2013.01); H01L 21/76829 (2013.01); H01L 21/76835 (2013.01); H01L 21/76849 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure relates to a method and apparatus for improving back-end-of-the-line (BEOL) reliability. In some embodiments, the method forms an extreme low-k (ELK) dielectric layer having one or more metal layer structures over a semiconductor substrate. A first capping layer is formed over the ELK dielectric layer at a position between the one or more metal layer structures. A second capping layer is then deposited over the one or more metal layer structures at a position that is separated from the ELK dielectric layer by the first capping layer. The first capping layer has a high selectivity that limits interaction between the second capping layer and the ELK dielectric layer, reducing diffusion of the atoms from the second capping layer to the ELK dielectric layer and improving dielectric breakdown of the ELK dielectric layer.


Find Patent Forward Citations

Wang, Chao-Chun. (2016). Capping layer for improved deposition selectivity (U.S. Patent No. 9396990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9396990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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