The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Feb. 18, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chao-Hsuing Chen, Tainan, TW;

Ling-Sung Wang, Tainan, TW;

Chi-Yen Lin, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/04 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66636 (2013.01); H01L 29/045 (2013.01); H01L 29/0847 (2013.01); H01L 29/7848 (2013.01);
Abstract

Some embodiments of the present disclosure relates to a method and a device to achieve a strained channel. A volume of a source or drain recess is controlled by a performing an etch of a substrate to produce a recess. An anisotropic etch stop layer is then formed by doping a bottom surface of the recess with a boron-containing dopant, which distorts the crystalline structure of the bottom surface. An anisotropic etch of the recess is then performed. The anisotropic etch stop layer resists anisotropic etching such that the recess comprises a substantially flat bottom surface after the anisotropic etch. The source or drain recess is then filled with a stress-inducing material to produce a strained channel.


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