The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Feb. 25, 2015
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Tsukasa Nakai, Yokkaichi Mie, JP;

Masaki Kondo, Yokkaichi Mie, JP;

Hikari Tajima, Koganei Tokyo, JP;

Hiroki Tokuhira, Kawasaki Kanagawa, JP;

Takashi Izumida, Yokohama Kanagawa, JP;

Takashi Kurusu, Yamato Kanagawa, JP;

Nobutoshi Aoki, Yokohama Kanagawa, JP;

Takahisa Kanemura, Yokohama Kanagawa, JP;

Tadayoshi Uechi, Kawasaki Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); H01L 45/00 (2006.01); G11C 11/16 (2006.01); G11C 13/00 (2006.01); H01L 23/528 (2006.01); H01L 27/22 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); G11C 7/12 (2006.01); G11C 8/14 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2481 (2013.01); G11C 11/1655 (2013.01); G11C 11/1659 (2013.01); G11C 11/1673 (2013.01); G11C 11/1675 (2013.01); G11C 13/003 (2013.01); G11C 13/004 (2013.01); G11C 13/0026 (2013.01); G11C 13/0069 (2013.01); H01L 23/528 (2013.01); H01L 27/228 (2013.01); H01L 27/2436 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 45/1226 (2013.01); H01L 45/1253 (2013.01); H01L 45/145 (2013.01); H01L 45/146 (2013.01); G11C 7/12 (2013.01); G11C 8/14 (2013.01); G11C 13/0004 (2013.01); G11C 13/0007 (2013.01); G11C 2013/005 (2013.01); G11C 2013/009 (2013.01); G11C 2213/71 (2013.01); G11C 2213/78 (2013.01); G11C 2213/79 (2013.01);
Abstract

An integrated circuit device according to an embodiment includes a semiconductor substrate, a first semiconductor member and a second semiconductor member provided on the semiconductor substrate, a first electrode disposed between the first semiconductor member and the second semiconductor member, and a second electrode disposed between the semiconductor substrate and the first electrode. The first semiconductor member and the second semiconductor member extend in a first direction perpendicular to an upper surface of the semiconductor substrate. The first semiconductor member and the second semiconductor member are separated in a second direction orthogonal to the first direction. The first electrode extends in a third direction intersecting both the first direction and the second direction. The second electrode extends in the third direction.


Find Patent Forward Citations

Loading…