The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Dec. 05, 2011
Shingo Yasuda, Tokyo, JP;
Fumio Kuriyama, Tokyo, JP;
Masashi Shimoyama, Tokyo, JP;
Mizuki Nagai, Tokyo, JP;
Yusuke Tamari, Tokyo, JP;
Shingo Yasuda, Tokyo, JP;
Fumio Kuriyama, Tokyo, JP;
Masashi Shimoyama, Tokyo, JP;
Mizuki Nagai, Tokyo, JP;
Yusuke Tamari, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.