The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Dec. 19, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Mitsuhiro Okada, Nirasaki, JP;

Akinobu Kakimoto, Nirasaki, JP;

Kazuhide Hasebe, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/52 (2006.01); C23C 16/02 (2006.01); C23C 16/24 (2006.01); C30B 25/18 (2006.01); C30B 29/06 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/0272 (2013.01); C23C 16/24 (2013.01); C30B 25/183 (2013.01); C30B 29/06 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02488 (2013.01); H01L 21/02505 (2013.01); H01L 21/02532 (2013.01); H01L 21/02573 (2013.01);
Abstract

Provided is an apparatus for forming a silicon-containing thin film, the apparatus including a controller which is configured to control a process gas supplying mechanism, a heating device, and an exhauster to perform: forming a first seed layer on a base by adsorbing at least silicon included in an aminosilane-based gas on the base, using the aminosilane-based gas; forming a second seed layer on the first seed layer by depositing at least silicon included in a higher-order silane-based gas having an order that is equal to or higher than disilane, using the higher-order silane-based gas having an order that is equal to or higher than the disilane, wherein the first seed layer and the second seed layer form a dual seed layer; and forming the silicon-containing thin film on the dual seed layer.


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