The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Oct. 08, 2014
Applicants:

Sunedison Semiconductor Limited (Uen201334164h), Singapore, SG;

Kansas State University Research Foundation, Manhattan, KS (US);

Inventors:

Michael R. Seacrist, Lake St. Louis, MO (US);

Vikas Berry, Manhattan, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 29/16 (2006.01); H01L 21/283 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01L 29/1606 (2013.01); H01L 21/0237 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02488 (2013.01); H01L 21/02491 (2013.01); H01L 21/02502 (2013.01); H01L 21/02527 (2013.01); H01L 21/283 (2013.01); H01L 29/06 (2013.01); B82Y 40/00 (2013.01);
Abstract

The invention generally related to a method for preparing a layer of graphene directly on the surface of a semiconductor substrate. The method includes forming a carbon-containing layer on a front surface of a semiconductor substrate and depositing a metal film on the carbon layer. A thermal cycle degrades the carbon-containing layer, which forms graphene directly upon the semiconductor substrate upon cooling. In some embodiments, the carbon source is a carbon-containing gas, and the thermal cycle causes diffusion of carbon atoms into the metal film, which, upon cooling, segregate and precipitate into a layer of graphene directly on the semiconductor substrate.


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