The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Dec. 29, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ruqiang Bao, Wappingers Falls, NY (US);

Unoh Kwon, Fishkill, NY (US);

Rekha Rajaram, Scarsdale, NY (US);

Keith Kwong Hon Wong, Wappingers Falls, NY (US);

Assignee:

GlobalFoundries, Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/40 (2006.01); H01L 29/51 (2006.01); H01L 21/3213 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823828 (2013.01); H01L 21/32134 (2013.01); H01L 27/092 (2013.01); H01L 27/0922 (2013.01); H01L 29/401 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method includes forming an n-FET device and a p-FET device on a substrate, each of the n-FET device and the p-FET device include a metal gate stack consisting of a titanium-aluminum carbide (TiAlC) layer above and in direct contact with a titanium nitride (TiN) cap, and removing, from the p-FET device, the TiAlC layer selective to the TiN cap. The removal of the TiAlC layer includes using a selective TiAlC to TiN wet etch chemistry solution with a substantially high TiAlC to TiN etch ratio such that the TiN cap remains in the p-FET device.


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