The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Nov. 06, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shuji Iwanaga, Koshi, JP;

Tadashi Nishiyama, Koshi, JP;

Hiroshi Tomita, Koshi, JP;

Izumi Hasegawa, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A potential trouble can be in advance suppressed by analyzing a defect of a wafer. A defect analyzing apparatus of analyzing a defect of a substrate includes an imaging unit configured to image target substrates; a defect feature value extracting unit configured to extract a defect feature value in a surface of the substrate based on the substrate image; a defect feature value accumulating unit configured to calculate an accumulated defect feature value with respect to the substrates to create an accumulation data AH; a defect determination unit configured to determine whether the accumulated defect feature value exceeds a preset critical value; and an output display unit configured to output a determination result from the defect determination unit.


Find Patent Forward Citations

Iwanaga, Shuji. (2016). Defect analyzing apparatus, substrate processing system, defect analyzing method and computer-readable storage medium (U.S. Patent No. 9342880). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9342880

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