The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2016

Filed:

Oct. 10, 2013
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Brian Reiss, Woodridge, IL (US);

Jakub Nalaskowski, Aurora, IL (US);

Viet Lam, Naperville, IL (US);

Renhe Jia, Naperville, IL (US);

Jeffrey Dysard, St. Charles, IL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/02013 (2013.01); H01L 21/30625 (2013.01);
Abstract

The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are ceria particles, second abrasive particles, wherein the second abrasive particles are ceria particles, surface-modified silica particles, or organic particles, a pH-adjusting agent, and an aqueous carrier. The polishing compositions also exhibit multimodal particle size distributions.


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