The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Feb. 04, 2013
Applicants:
Chu-an Lee, Hsinchu, TW;
Hui-chi Huang, Taipei, TW;
Peng-chung Jangjian, Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/465 (2006.01); B24B 37/20 (2012.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); H01J 37/32 (2006.01); H01L 21/66 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/013 (2013.01); B24B 37/205 (2013.01); B24B 49/12 (2013.01); G05B 2219/49085 (2013.01); H01J 37/32963 (2013.01); H01L 21/3212 (2013.01); H01L 22/26 (2013.01); H01L 2924/0002 (2013.01);
Abstract
The present disclosure provides a chemical mechanical polishing (CMP) system. The CMP system includes a pad designed for wafer polishing, a motor driver coupled with the pad and designed to drive the pad during the wafer polishing, and a controller coupled with the motor driver and designed to control the motor driver. The CMP system further includes an in-situ rate monitor designed to collect polishing data from a wafer on the pad, determine CMP endpoint based on a life stage of the pad, and provide the CMP endpoint to the controller.