The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Jan. 08, 2014
Applicant:

Peking University, Beijing, CN;

Inventors:

Ru Huang, Beijing, CN;

Meng Lin, Beijing, CN;

Xia An, Beijing, CN;

Ming Li, Beijing, CN;

Quanxin Yun, Beijing, CN;

Zhiqiang Li, Beijing, CN;

Min Li, Beijing, CN;

Pengqiang Liu, Beijing, CN;

Xing Zhang, Beijing, CN;

Assignee:

Peking University, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02321 (2013.01); H01L 21/0206 (2013.01); H01L 21/0234 (2013.01); H01L 21/28255 (2013.01); H01L 21/28264 (2013.01); H01L 21/324 (2013.01); H01L 21/3245 (2013.01);
Abstract

The present invention discloses a method for processing a gate dielectric layer deposited on a germanium-based or Group III-V compound-based substrate, belonging to a semiconductor device field. The method comprises the steps of depositing a high-K gate dielectric layer on the germanium-based or Group III-V compound-based substrate, and then performing a plasma process to the high-K gate dielectric layer by using fluorine plasma, wherein during the plasma process, a guiding electric field is applied so that fluorine ions, when being accelerated to a surface of the gate dielectric layer, has an energy of 5-50 eV and the fluorine plasma drifts into the high-K gate dielectric layer, a ratio of a density of the fluorine ions in the high-K gate dielectric layer and a density of oxygen atoms in the high-K gate dielectric layer being 0.01-0.15:1.


Find Patent Forward Citations

Loading…