The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Aug. 07, 2009
Makoto Fukushima, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Shingo Saito, Tokyo, JP;
Tomoshi Inoue, Tokyo, JP;
Makoto Fukushima, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Shingo Saito, Tokyo, JP;
Tomoshi Inoue, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table () having a polishing surface, a top ring () for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism () for moving the top ring () in a vertical direction. The top ring () is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring () is moved to a second height after the substrate is pressed against the polishing surface.