The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Dec. 21, 2013
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Hsu-Sheng Yu, Hsinchu County, TW;

Hong-Ji Lee, Taoyuan County, TW;

N. T. Lian, Hsinchu, TW;

T. H. Yang, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/67207 (2013.01); H01L 21/76843 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A cluster tool is disclosed that can increase throughput of a wafer fabrication process by facilitating removal of barrier overhang in contact holes of contact film stacks. Individual chambers of the cluster tool provide for deposition of barrier material onto a semiconductor structure, depositing over with an amorphous carbon film (ACF), etching back the ACF, and etching a corner region of the contact hole. Removal of the barrier overhang improves the quality of metal fill-in of the contact hole. An expectedly ensuing feature entails a technique in which filling-in of the contact hole with a metal such as tungsten can be achieved with attenuated or eliminated adverse consequence.


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