The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Jun. 19, 2015
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Hung Hung, Kanagawa-ken, JP;

Naoharu Sugiyama, Kanagawa-ken, JP;

Hisashi Yoshida, Tokyo, JP;

Toshiki Hikosaka, Kanagawa-ken, JP;

Yoshiyuki Harada, Tokyo, JP;

Shinya Nunoue, Chiba-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 33/00 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 29/20 (2006.01); H01L 29/207 (2006.01); H01L 29/06 (2006.01); H01L 29/201 (2006.01); H01L 29/36 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02458 (2013.01); H01L 21/02505 (2013.01); H01L 21/02576 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01); H01L 29/0684 (2013.01); H01L 29/201 (2013.01); H01L 29/2003 (2013.01); H01L 29/207 (2013.01); H01L 29/36 (2013.01); H01L 31/1848 (2013.01); H01L 31/1856 (2013.01); H01L 33/002 (2013.01); H01L 33/0075 (2013.01); H01L 33/12 (2013.01); H01L 33/32 (2013.01); H01L 33/325 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a functional layer of a nitride semiconductor. The functional layer is provided on a nitride semiconductor layer including a first stacked multilayer structure provided on a substrate. The first stacked multilayer structure includes a first lower layer, a first intermediate layer, and a first upper layer. The first lower layer contains Si with a first concentration and has a first thickness. The first intermediate layer is provided on the first lower layer to be in contact with the first lower layer, contains Si with a second concentration lower than the first concentration, and has a second thickness thicker than the first thickness. The first upper layer is provided on the first intermediate layer to be in contact with the first intermediate layer, contains Si with a third concentration lower than the second concentration, and has a third thickness.


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