The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Sep. 27, 2012
Applicant:

Hitachi High-technologies Corporation, Minato-ku, Tokyo, JP;

Inventors:

Takeyoshi Ohashi, Tokyo, JP;

Junichi Tanaka, Tokyo, JP;

Tomoko Sekiguchi, Tokyo, JP;

Hiroki Kawada, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/28 (2006.01); G01B 15/04 (2006.01); G01N 23/22 (2006.01);
U.S. Cl.
CPC ...
H01J 37/28 (2013.01); G01B 15/04 (2013.01); G01N 23/22 (2013.01); G01B 2210/56 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/2817 (2013.01);
Abstract

The objective of the invention is to provide a measuring method that can determine pattern contours and dimensions with high precision even if an object to be measured shrinks due to electron beam radiations. In order to achieve this objective, a method, which performs measurements by irradiating an electron beam onto a sample having a pattern formed on a primary coating thereof, prepares an SEM image and contour of the pattern (S, S), material parameters of the pattern part and primary coating part of the sample (S, S), and a beam condition in irradiating the electron beam onto the sample (S), and uses these prepared things to calculate a pattern shape or dimensions before the irradiation of the electron beam (S).


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