The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Mar. 11, 2014
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Steven Grumbine, Aurora, IL (US);

Jeffrey Dysard, St. Charles, IL (US);

Lin Fu, Naperville, IL (US);

William Ward, Glen Ellyn, IL (US);

Glenn Whitener, Batavia, IL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract

A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, and a polycationic amine compound in solution in the liquid carrier. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.


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