The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2016

Filed:

Sep. 04, 2012
Applicants:

Kenji Momose, Chichibu, JP;

Michiya Odawara, Chichibu, JP;

Daisuke Muto, Chichibu, JP;

Yoshiaki Kageshima, Chichibu, JP;

Inventors:

Kenji Momose, Chichibu, JP;

Michiya Odawara, Chichibu, JP;

Daisuke Muto, Chichibu, JP;

Yoshiaki Kageshima, Chichibu, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C30B 25/20 (2006.01); C30B 29/36 (2006.01); C30B 25/18 (2006.01); H01L 29/32 (2006.01); H01L 29/16 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02617 (2013.01); C30B 25/186 (2013.01); C30B 25/20 (2013.01); C30B 29/36 (2013.01); H01L 21/02024 (2013.01); H01L 21/02046 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02634 (2013.01); H01L 21/02658 (2013.01); H01L 29/32 (2013.01); H01L 29/045 (2013.01); H01L 29/1608 (2013.01);
Abstract

A method of manufacturing a SiC epitaxial wafer wherein a SiC epitaxial layer is provided on a SiC single crystal substrate having an off angle. The method includes determining a ratio of basal plane dislocations (BPD) which cause stacking faults in a SiC epitaxial film of a prescribed thickness, to basal plane dislocations which are present on a growth surface of the SiC single crystal substrate, determining an upper limit of surface density of basal plane dislocations, preparing a SiC single crystal substrate which has surface density equal to or less than the above upper limit, and forming a SiC epitaxial film on the SiC single crystal substrate under the same conditions as the growth conditions of the epitaxial film used in the step of determining the ratio.


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