The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Apr. 22, 2014
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Ming Han Lee, Taipei, TW;
Hai-Ching Chen, Hsinchu, TW;
Hsiang-Huan Lee, Jhodong Township, TW;
Tien-I Bao, Dayuan Township, TW;
Chi-Lin Teng, Taichung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
Some embodiments of the present disclosure relate to an interconnect structure for connecting devices of a semiconductor substrate. The interconnect structure includes a dielectric layer over the substrate and a continuous conductive body passing through the dielectric layer. The continuous conductive body is made up of a lower body region and an upper body region. The lower body region has a first width defined between opposing lower sidewalls of the continuous conductive body, and the upper body region has a second width defined between opposing upper sidewalls of the continuous conductive body. The second width is less than the first width. A barrier layer separates the continuous conductive body from the dielectric layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile