The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Dec. 29, 2014
Dow Corning Corporation, Midland, MI (US);
Darren Hansen, Midland, MI (US);
Mark Loboda, Bay City, MI (US);
Ian Manning, Midland, MI (US);
Kevin Moeggenborg, Midland, MI (US);
Stephan Mueller, Midland, MI (US);
Christopher Parfeniuk, Midland, MI (US);
Jeffrey Quast, Bay City, MI (US);
Victor Torres, Midland, MI (US);
Clinton Whiteley, Midland, MI (US);
DOW CORNING CORPORATION, Midland, MI (US);
Abstract
A method for producing silicon carbide substrates fit for epitaxial growth in a standard epitaxial chamber normally used for silicon wafers processing. Strict limitations are placed on any substrate that is to be processed in a chamber normally used for silicon substrates, so as to avoid contamination of the silicon wafers. To take full advantage of standard silicon processing equipment, the SiC substrates are of diameter of at least 150 mm. For proper growth of the SiC boule, the growth crucible is made to have interior volume that is six to twelve times the final growth volume of the boule. Also, the interior volume of the crucible is made to have height to width ratio of 0.8 to 4.0. Strict limits are placed on contamination, particles, and defects in each substrate.