The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jan. 20, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;

Inventors:

Chao-Hsuing Chen, Tainan, TW;

Ling-Sung Wang, Tainan, TW;

Chi-Yen Lin, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/36 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/165 (2006.01); H01L 27/092 (2006.01); H01L 29/10 (2006.01); H01L 29/161 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/36 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 27/0928 (2013.01); H01L 29/06 (2013.01); H01L 29/1058 (2013.01); H01L 29/1079 (2013.01); H01L 29/161 (2013.01); H01L 29/165 (2013.01); H01L 29/66636 (2013.01); H01L 29/78 (2013.01);
Abstract

Among other things, a semiconductor device or transistor and a method for forming the semiconductor device are provided for herein. The semiconductor device comprises one or more v-shaped recesses in which stressed monocrystalline semiconductor material, such as silicon germanium, is grown, to form at least one of a source or a drain of the semiconductor device. The one or more v-shaped recesses are etched into a substrate in-situ. The semiconductor device comprises at least one of a source or a drain having a height-to-length ratio exceeding at least 1.6 when poly spacing between a first part of the semiconductor device (e.g., first transistor) and a second part of the semiconductor device (e.g., second transistor) is less than about 60 nm.


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