The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Oct. 31, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Kuan-Yu Lin, Zhudong Township, TW;

Jung-Rung Jiang, Chung-Li, TW;

Chin-Her Chien, Chung-Li, TW;

Ji-Jan Chen, Kaohsiung, TW;

Wei-Pin Changchien, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/76895 (2013.01); H01L 23/525 (2013.01); H01L 23/5226 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes a first plurality of circuit elements where a first portion of the first plurality of circuit elements has defects. The second layer includes a second plurality of circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second plurality of circuit elements for mitigating the defects.


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