The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Feb. 26, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Rudolf Berger, Regensburg, DE;
Hermann Gruber, Woerth a. D., DE;
Wolfgang Lehnert, Lintach, DE;
Guenther Ruhl, Regensburg, DE;
Raimund Foerg, Straubing, DE;
Anton Mauder, Kolbermoor, DE;
Hans-Joachim Schulze, Taufkirchen, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/762 (2006.01); H01L 29/02 (2006.01); H01L 29/16 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); H01L 21/02002 (2013.01); H01L 21/7624 (2013.01); H01L 29/02 (2013.01); H01L 29/16 (2013.01); H01L 29/1608 (2013.01); H01L 21/0237 (2013.01); H01L 21/0243 (2013.01); H01L 21/02527 (2013.01); H01L 21/02601 (2013.01); H01L 21/02628 (2013.01);
Abstract
A composite wafer including a carrier substrate having a graphite core and a monocrystalline semiconductor substrate or layer attached to the carrier substrate and a corresponding method for manufacturing such a composite wafer is provided.