The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Oct. 23, 2012
Jun Qian, Sunnyvale, CA (US);
Sivakumar Dhandapani, San Jose, CA (US);
Benjamin Cherian, San Jose, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Jeffrey Drue David, San Jose, CA (US);
Gregory E. Menk, Pleasanton, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
Jun Qian, Sunnyvale, CA (US);
Sivakumar Dhandapani, San Jose, CA (US);
Benjamin Cherian, San Jose, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Jeffrey Drue David, San Jose, CA (US);
Gregory E. Menk, Pleasanton, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.