The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Feb. 27, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ru-Shang Hsiao, Hsinchu County, TW;

I-I Cheng, Tainan, TW;

Jia-Ming Huang, Tainan, TW;

Jen-Pan Wang, Tainan, TW;

Ling-Sung Wang, Tainan, TW;

Chih-Mu Huang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); G03F 1/42 (2012.01); H01L 23/544 (2006.01); H01L 21/027 (2006.01); G06T 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 1/42 (2013.01); G06T 7/001 (2013.01); H01L 21/027 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A semiconductor device includes a first material formed on a substrate. The first material includes a first alignment mark. The first alignment mark includes alignment lines in at least three directions. The semiconductor device further includes a second material comprising a second alignment mark. The second alignment mark corresponds to the first alignment mark such that when the second alignment mark is aligned with the first alignment mark, the second material is aligned with the first material.


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