The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Jul. 19, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Gerd Zschaetzsch, Dresden, DE;

Stefan Flachowsky, Dresden, DE;

Dominic Thurmer, Dresden, DE;

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/225 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66553 (2013.01); H01L 21/2254 (2013.01); H01L 21/823431 (2013.01); H01L 29/6659 (2013.01); H01L 29/66803 (2013.01); H01L 29/785 (2013.01); H01L 29/7834 (2013.01);
Abstract

The present disclosure provides in various aspects methods of forming a semiconductor device, methods for forming a semiconductor device structure, a semiconductor device and a semiconductor device structure. In some illustrative embodiments herein, a gate structure is formed over a non-planar surface portion of a semiconductor material provided on a surface of a substrate. A doped spacer-forming material is formed over the gate structure and the semiconductor material and dopants incorporated in the doped spacer-forming material are diffused into the semiconductor material close to a surface of the semiconductor material so as to form source/drain extension regions. The fabricated semiconductor devices may be multi-gate devices and, for example, comprise finFETs and/or wireFETs.


Find Patent Forward Citations

Loading…