The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Feb. 03, 2011
Applicants:
Hidefumi Matsui, Nirasaki, JP;
Tsuyoshi Moriya, Tokyo, JP;
Masaki Narushima, Nirasaki, JP;
Inventors:
Assignees:
TOKYO ELECTRON LIMITED, Tokyo, JP;
IWATANI CORPORATION, Osaka-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
B08B 5/02 (2006.01); B08B 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); B08B 5/02 (2013.01); H01L 21/02046 (2013.01); H01L 21/67028 (2013.01);
Abstract
A substrate cleaning method includes removing a foreign material attached to a substrate while preventing deterioration of the substrate and any film formed on or above the substrate. A cleaning gas at a pressure between 0.3 MPa and 2.0 MPa is sprayed towards a wafer W with attached foreign materialplaced in a near-vacuum, producing clustersmade up of a multitude of gas molecules, and the clusterscollide with the wafer W without undergoing ionization.