The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2015

Filed:

Jun. 02, 2011
Applicants:

Jia-rui HU, Taichung, TW;

Te-chih Huang, Chu-Bei, TW;

Chih-ming KE, Hsinchu, TW;

Hua-tai Lin, Hsinchu, TW;

Tsai-sheng Gau, Hsinchu, TW;

Inventors:

Jia-Rui Hu, Taichung, TW;

Te-Chih Huang, Chu-Bei, TW;

Chih-Ming Ke, Hsinchu, TW;

Hua-Tai Lin, Hsinchu, TW;

Tsai-Sheng Gau, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G01N 21/95 (2006.01); G06T 7/00 (2006.01); G01N 23/00 (2006.01); G01N 21/956 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 23/00 (2013.01); G06T 7/0004 (2013.01); G06T 7/0006 (2013.01); G01N 21/95607 (2013.01); G01N 2021/8825 (2013.01); G01N 2021/8861 (2013.01); G01N 2021/8867 (2013.01); G01N 2021/8874 (2013.01); G01N 2021/95676 (2013.01); G06T 2207/30148 (2013.01);
Abstract

In one embodiment, a method for extracting systematic defects is provided. The method includes inspecting a wafer outside a process window to obtain inspection data, defining a defect pattern from the inspection data, filtering defects from design data using a pattern search for the defined defect pattern within the design data, inspecting defects inside the process window with greater sensitivity than outside the process window, and determining systematic defects inside the process window. A computer readable storage medium, and a system for extracting systematic defects are also provided.


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