The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jul. 07, 2014
Applicant:

Intermolecular Inc., San Jose, CA (US);

Inventors:

Michael Miller, San Jose, CA (US);

Tony P. Chiang, Campbell, CA (US);

Xiying Costa, Milpitas, CA (US);

Tanmay Kumar, Pleasanton, CA (US);

Prashant B Phatak, San Jose, CA (US);

April Schricker, Milpitas, CA (US);

Assignee:

Intermolecular, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 45/00 (2006.01); H01L 21/265 (2006.01); H01L 21/3115 (2006.01); H01L 29/861 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 45/16 (2013.01); H01L 21/265 (2013.01); H01L 21/31155 (2013.01); H01L 29/8615 (2013.01); H01L 45/08 (2013.01); H01L 45/10 (2013.01); H01L 45/12 (2013.01); H01L 45/1233 (2013.01); H01L 45/146 (2013.01); H01L 45/165 (2013.01); H01L 45/1608 (2013.01); H01L 45/1616 (2013.01); H01L 45/1625 (2013.01); H01L 45/1641 (2013.01); H01L 27/2463 (2013.01);
Abstract

This disclosure provides a method of fabricating a semiconductor device layer and associated memory cell structures. By performing a surface treatment process (such as ion bombardment) of a semiconductor device layer to create defects having a deliberate depth profile, one may create multistable memory cells having more consistent electrical parameters. For example, in a resistive-switching memory cell, one may obtain a tighter distribution of set and reset voltages and lower forming voltage, leading to improved device yield and reliability. In at least one embodiment, the depth profile is selected to modulate the type of defects and their influence on electrical properties of a bombarded metal oxide layer and to enhance uniform defect distribution.


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