The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Feb. 10, 2014
Applicants:

Intermolecular, Inc., San Jose, CA (US);

Elpida Memory, Inc., Tokyo, JP;

Inventors:

Xiangxin Rui, Campbell, CA (US);

Hanhong Chen, Milpitas, CA (US);

Naonori Fujiwara, Kure, JP;

Imran Hashim, Saratoga, CA (US);

Kenichi Koyanagi, Higashihiroshima, JP;

Assignees:

Intermolecular, Inc., San Jose, CA (US);

Elpida Memory, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 27/108 (2006.01); H01G 4/10 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 27/1085 (2013.01); H01L 28/56 (2013.01); H01G 4/10 (2013.01);
Abstract

A method for reducing the leakage current in DRAM MIM capacitors comprises forming a multi-layer dielectric stack from an amorphous highly doped material, an amorphous high band gap material, and a lightly-doped or non-doped material. The highly doped material will remain amorphous (<30% crystalline) after an anneal step. The high band gap material will remain amorphous (<30% crystalline) after an anneal step. The lightly-doped or non-doped material will become crystalline (≧30% crystalline) after an anneal step. The high band gap material is formed between the amorphous highly doped material and the lightly or non-doped material and provides an intermediate barrier to conduction through the multi-layer dielectric stack.


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