The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Sep. 25, 2013
Xintec Inc., Jhongli, Taoyuan County, TW;
Yu-Ting Huang, Zhongli, TW;
Tsang-Yu Liu, Zhubei, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package for a sensing element. The chip package includes a substrate having a first surface and a second surface, and a sensing layer having a sensing region disposed on the first surface of the substrate. A conducting pad structure is disposed on the substrate and electrically connected to the sensing region, and a spacer layer is disposed on the first surface of the substrate. A semiconductor substrate is place on the spacer layer. The semiconductor substrate, the spacer layer, and the substrate together surround a cavity on the sensing region. A through-hole extends from a surface of the semiconductor substrate toward the substrate, and connects to the cavity.