The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jan. 28, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Douglas D. Coolbaugh, Essex Junction, VT (US);
Keith E. Downes, Stowe, VT (US);
Peter J. Lindgren, Essex Junction, VT (US);
Anthony K. Stamper, Williston, VT (US);
Assignee:
GLOBALFOUNDRIES U.S. 2 LLC, Hopewell Junction, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/76808 (2013.01); H01L 21/76813 (2013.01); H01L 21/76832 (2013.01); H01L 23/5223 (2013.01); H01L 28/60 (2013.01); H01L 2221/1036 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method and a semiconductor device are provided. The semiconductor device includes a partial via etched in a stacked structure and a trough above the partial via. The method includes performing thick wiring using selective etching while etching the partial via to an etch stop layer.