The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Nov. 20, 2013
Applicant:

Shanghai Huali Microelectronics Corporation, Shanghai, CN;

Inventors:

Jun Huang, Shanghai, CN;

ZhiBiao Mao, Shanghai, CN;

QuanBo Li, Shanghai, CN;

ZhiFeng Gan, Shanghai, CN;

RunLing Li, Shanghai, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/306 (2006.01); H01L 21/28 (2006.01); H01L 21/033 (2006.01); H01L 21/3213 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/306 (2013.01); H01L 21/0337 (2013.01); H01L 21/28123 (2013.01); H01L 21/32139 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01);
Abstract

The invention relates to microelectronic technology and, more specifically, relates to a method of forming a gate with a LELE double pattern. The method adopts an ONO structure (Oxide-SiN-Oxide). The ONO structure is exposed twice, and the advanced patterning film is used as a mask in the processing of polysilicon etching. The ONO structure is used to replace the traditional hardmask of silicon oxide, and the substructure of ODL (Organic Under Layer) which is based on the spin-on, and the middle layer structure of SHB (Si-based hardmask). The method saves cost and improves the process of advanced patterning film as a mask with the nodes in 40 nm and above which is applied to the process with the nodes in 22/20 nm and below. Consequently, the maturity and stability of the process for poly gate with the nodes in 22/20 nm and below are improved.


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