The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
May. 16, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Rahul N. Manepalli, Chandler, AZ (US);
Mohit Mamodia, Chandler, AZ (US);
David Xu, Chandler, AZ (US);
Javier Soto Gonzalez, Chandler, AZ (US);
Edward R. Prack, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/10523 (2013.01);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.