The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Apr. 17, 2013
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Shouhong Tang, Santa Clara, CA (US);

Chunhai Wang, Pleasanton, CA (US);

Andrew An Zeng, Fremont, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/02 (2006.01); G01B 9/02 (2006.01); G01B 11/06 (2006.01); G01B 11/24 (2006.01);
U.S. Cl.
CPC ...
G01B 9/02072 (2013.04); G01B 9/02021 (2013.01); G01B 9/02027 (2013.01); G01B 11/06 (2013.01); G01B 11/2441 (2013.01);
Abstract

A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.


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