The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Feb. 25, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Roger A. Booth, Jr., Irvine, CA (US);

Kangguo Cheng, Schenectady, NY (US);

Joseph Ervin, Wappingers Falls, NY (US);

Chengwen Pei, Danbury, CT (US);

Ravi M. Todi, San Diego, CA (US);

Geng Wang, Stormville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); B44C 1/22 (2006.01); H01L 21/3105 (2006.01); H01L 21/033 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31056 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/32139 (2013.01);
Abstract

A method includes forming patterned lines on a substrate having a predetermined pitch. The method further includes forming spacer sidewalls on sidewalls of the patterned lines. The method further includes forming material in a space between the spacer sidewalls of adjacent patterned lines. The method further includes forming another patterned line from the material by protecting the material in the space between the spacer sidewalls of adjacent patterned lines while removing the spacer sidewalls. The method further includes transferring a pattern of the patterned lines and the patterned line to the substrate.


Find Patent Forward Citations

Loading…