The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2015

Filed:

Jan. 21, 2014
Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Tatsuya Sakai, Tokyo, JP;

Hideki Nishimura, Tokyo, JP;

Masahiro Yamamoto, Tokyo, JP;

Hisashi Nakagawa, Tokyo, JP;

Ryuuichi Saitou, Tokyo, JP;

Hideyuki Aoki, Tokyo, JP;

Tsuyoshi Furukawa, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/06 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); C23C 16/18 (2006.01);
U.S. Cl.
CPC ...
C23C 16/06 (2013.01); C23C 16/18 (2013.01); H01L 21/28556 (2013.01); H01L 21/32051 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01);
Abstract

Provided is a method for producing a substrate with a metal body. This method provides excellent film-forming properties (reflectance and adhesion), is easy to be used on a large substrate, and can be carried out at a low cost. The method includes the steps of: (A) heating a complex to a first temperature so as to generate a vapor of the complex; and (B) contacting the vapor with a substrate heated to a second temperature that is not higher than the first temperature so as to form a metal body containing a central metal of the complex, either in uncombined form or as a compound thereof (exclusive of the complex), on at least part of a surface of the substrate. The second temperature in step (B) is lower than the decomposition temperature of the complex. The central metal of the complex is aluminum or titanium.


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